packaging density meaning in Chinese
包装密度；对装密度
存储密度
封装密度
装配密度
组装密度
Examples
- The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays
减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。 - With increasing of packaging density and power , the technologies of cooling and heat dissipation and thermal stress become important problems to be resolved
随着封装密度和功率的提高,冷却和散热以及由温度引起的热应力问题是必须要考虑的重要技术课题。 - As an advanced package , 3 - d stacked csp assembly provides significant size and performance advantages than traditional single chip package . meanwhile , high packaging density tends to generate more power in a package and cause serious thermal problem
三维叠层芯片尺寸封装( stackedchipscalepackage )是目前最先进的微电子封装形式之一,具有体积小、重量轻、封装效率高等特点。 - It ' s a method to realize system integration . the hdi substrate is critical to mcm . aluminum nitride ( a1n ) has been considered as a material for ceramic packaging in view of the recent trends in the semiconductor industry toward higher speed , power dissipation and packaging density
Mcm还能够实现电子系统的小型化、高密度化，是实现系统集成的重要途径，在mcm中高密度布线的多层基板技术是实现高密度封装的关键。 - The flip chip technology developed recently provides the shortest possible leads , lowest inductance , highest frequency , best noise control , highest packaging density , greatest number of inputs / outputs ( i / 0 ' s ) and lowest profile when compared with other popular interconnect technologies
新近发展起来的电子封装倒装焊技术，具有封装密度高、信号处理速度快、寄生电容/电感小等优点，是目前最具发展前景的先进封装技术之一。